spice language in the pspice (COMSOL Inc)
90
Structured Review
COMSOL Inc
spice language in the pspice
Spice Language In The Pspice, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/spice+language+in+the+pspice/spice+language+in+the+pspice/us12112110-42-28-40
Average 90 stars, based on 1 article reviews
Spice Language In The Pspice, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/spice+language+in+the+pspice/spice+language+in+the+pspice/us12112110-42-28-40
Average 90 stars, based on 1 article reviews
spice language in the pspice - by Bioz Stars,
2026-10
90/100 stars
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Construct:Article Title: Multi-physics co-simulation method of power semiconductor modules Article Snippet: As shown in FIG. 1, a multi-physics co-simulation method of a power semiconductor module, which is provided by an embodiment of the present invention comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. .. The coupling interface of the co-simulation, which is provided by the embodiment of the present invention, comprises: a circuit model constructed by using a Control:Article Title: Multi-physics co-simulation method of power semiconductor modules Article Snippet: As shown in FIG. 1, a multi-physics co-simulation method of a power semiconductor module, which is provided by an embodiment of the present invention comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. .. The coupling interface of the co-simulation, which is provided by the embodiment of the present invention, comprises: a circuit model constructed by using a |